Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 46 items
Minimizing development man-hours, industrial network embedded module.
Anybus CompactCom enables hardware development in one go, making multi-network deployment easy. It is an embedded module that can be selected from three implementation forms to match hardware and specifications.
Intel Pentium/Celeron N4200 series and Atom series
Intel Pentium/Celeron N4200 series and Atom series ● Intel Pentium/Celeron N4200 series and Atom SoC ● Qseven 2.1 specification ● Up to 16GB LPDDR4 onboard, up to 64GB eMMC onboard ● Supports HEVC/H.265, H.264 MPEG2 HW DECODE ● GbE, 3 PCIe x 1, 2 x USB3.0, 5 x USB2.0 ● Compatible with iManager WISE-PaaS/RMM and embedded software API
AMD Ryzen Embedded V Series Gaming Platform
- AMD Ryzen Embedded V1000 processor - High-performance Radeon VEGA series graphics - Supports four 4K monitors - Comprehensive gaming features - Maximum 25W with fan cooler, 54W passive cooling system - 12V DC single input or ATX power supply
Equipped with Intel Atom/Pentium/Celeron processors (Apollo Lake)
The SMARC module "PSMC-M101" is equipped with Intel Atom/Pentium/Celeron processors, and the system memory supports onboard DDR4 2133/2400. ● For more details, please download the catalog.
PCI-Express Gen3 with 7 lanes and support for USB4! Abundant and flexible interface configuration.
The "PCOM-B658VGL" is a COM-Express Type 6 module equipped with Intel's 12th/13th generation Core processors. It supports H series/P series/U series CPUs, offering a wide range of specifications from TDP 15W to 45W, allowing for selection based on application and usage environment. Additionally, it supports PCI-Express Gen4 and DDR5 memory, making it suitable for AI edge computing and mission-critical applications. 【Features】 ■ Equipped with Intel 12th/13th generation Core processors ■ Up to 6 P-cores, 8 E-cores, and 96 graphics execution units ■ Supports DDR5 memory, with the capability to implement 2 modules on the board ■ Optionally supports an industrial temperature range of -40℃ to 85℃ ■ Optionally supports onboard SSD *For more details, please download the PDF or feel free to contact us.
PCI-Express Gen3, two USB4 (optional), and USB3.2 Gen2 interfaces are also provided!
The PCOM-B659 is a COM-Express module compatible with the 13th generation Intel Core series processors. Depending on the CPU used, it offers a TDP ranging from 15W to 28W, and industrial-grade temperature range products can be selected according to your needs. It is also suitable for mission-critical applications and AI edge computing. 【Features】 ■ Equipped with 13th generation Intel Core series processors ■ Up to 6 P (Performance) cores + 8 E (Efficient) cores, 96 EUs ■ Supports up to 96GB of DDR5-5200 memory ■ Abundant PCI-Express lanes ■ Optional support for temperature range from -40℃ to 85℃ ■ Option to include onboard PCIe NVMe SSD *For more details, please download the PDF or feel free to contact us.
Supports 4K screen output! Excellent in both power efficiency and cost performance.
The "PCOM-BA03GL" is a COM-Express Type 10 Mini module equipped with the Intel Atom x7000 series processor (Amston Lake). This architecture offers low power consumption ranging from 6W to 12W while supporting screen output at up to 4K resolution via LVDS, HDMI, eDP, and DP, operating at 3.6GHz during turbo boost, and includes PCI-Express 3.0 lanes and USB 3.2 Gen 2, all while accommodating an industrial extended operating temperature range of -40°C to 85°C. It can be utilized in various fields, including industrial automation, medical, and transportation. 【Features】 ■ Equipped with Intel Atom x7000E series processor ■ Onboard LPDDR5 SDRAM expandable up to 16GB ■ Onboard eMMC expandable up to 64GB ■ Low power consumption (6W to 12W) ■ Supports 4K screen output ■ Operating temperature range of -40°C to 85°C *For more details, please download the PDF or feel free to contact us.
Intelligent XMC module capable of realizing EtherCAT master communication.
AdXMC1573 is an XMC module with EtherCAT master communication capabilities. The CPU uses the ARM Cortex-A9 found in the Xilinx Zynq, functioning as an intelligent type XMC module. The EtherCAT master protocol stack is equipped with acontis technologies' "EC Master" and is Class A compliant. It also supports cable redundancy and hot connect as part of its Feature Pack. This module is controlled by the host CPU. Data transfer is conducted via shared memory built into this module. It functions as an intelligent slave, enabling EtherCAT master communication without burdening the host CPU.
Introducing fanless compact systems with China Compulsory Certification (CCC certification)!
The "ATE3845.WS7E/4G/32G/EC7" is a compact fanless system that has obtained CCC certification and features a screw-lock AC adapter. It offers extensive expandability with four COM ports and five USB ports. It can be wall-mounted, VESA-mounted, or DIN rail-mounted. This product will be available for long-term supply until 2025. 【Features】 - Extensive expandability with four COM ports and five USB ports - Equipped with a screw-lock AC adapter - Wall mountable, VESA mountable, and DIN rail mountable - Product with China Compulsory Certification (CCC certification) *For more details, please refer to the PDF document or feel free to contact us.
NXP i.MX6 Cortex-A9 System on Module
The Digi ConnectCore 6N is an ultra-compact and highly integrated system on module (SOM) based on the NXP i.MX6 Cortex-A9 processor family. With a processor speed of up to 1.2GHz and fully interchangeable single/dual/quad-core types, the ConnectCore 6N offers scalable performance and a truly future-proof platform solution that includes certified 802.11a/b/g/n/ac and Bluetooth Low Energy, as well as Bluetooth 5.0 wireless connectivity. The low-profile surface mount design maximizes integration flexibility and significantly reduces design risk with a cost-effective and reliable form factor that enables optimal management even in the most challenging quad-core system configurations.
The VIA SOM-5000 module accelerates the development of advanced edge AI systems and devices.
The VIA SOM-5000 module, equipped with the new MediaTek Genio 700 octa-core processor, provides a flexible and feature-rich platform that reduces time to market for power-efficient smart home, retail, and industrial IoT systems and devices.
NXP i.MX93 series processor equipped OSM R1.1 Size L module
The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.
NXP i.MX95 series processor equipped OSM R1.2 Size L module
The ADLINK OSM-IMX95 is a compact module compliant with the latest OSM revision 1.2, based on the powerful NXP i.MX95 processor (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) and integrates an eIQ Neutron neural processing unit (NPU) that operates with an ISP and up to 2 TOPS. Its dimensions are 45mm x 45mm. It offers high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and features for fast data processing and security.
Supports short delivery times, with the ROM-ized OS (WES7P) pre-installed.
This is a compact fanless system equipped with a Dual Core CPU (Atom D2550 1.86GHz). It comes pre-installed with an industrial-grade OS (WES7P), allowing for immediate use. Additionally, we can accommodate short delivery times and ensure stable supply.
A CAD embedded module that easily outputs process data from AutoForm and can be imported into the CATIA environment.
"AutoForm-QuickLink for CATIA" is a CAD embedded module that provides a seamless data flow between AutoForm and CATIA. In the process design department, it is possible to enhance work efficiency through more efficient collaboration with internal and external departments. The output data includes concept shape data such as surfaces, curves, points, project information, material information, and process information. 【Features】 ■ Data exchange between AutoForm and CATIA ■ Consistency, transparency, and usability of data ■ Streamlining of CAD design processes ■ Prevention of downstream process issues 【Main Functions】 ■ Input and output only the necessary shape and process data between AutoForm and CATIA ■ Easily modify shapes, part positions, tipping, and cam directions ■ Consistent naming and terminology ■ Complete transfer of process structures *For more details, please refer to the PDF materials or feel free to contact us.
